Prof. David Bol
Electronic circuits and systems (ECS) group - ICTEAM institute
Université catholique de Louvain                             
1348 Louvain-la-Neuve, Belgium
david [dot] bol [at] uclouvain [dot] be


David Bol was born in Ottignies, Belgium in 1981. He received the M.Sc. degree in Electromechanical Engineering from Université catholique de Louvain (UCL), Louvain-la-Neuve, Belgium in 2004. From 2004 to 2008, he was a Ph.D student at the Microelectronics laboratory from UCL. In 2008, he received the Ph.D degree in Engineering Science for a dissertation entitled "Pushing Ultra-Low-Power Digital Circuits into the Nanometer Era".

In 2004, he was an exchange student at the KTH Royal Institute of Technology, Stockholm, Sweden, in embedded systems and in 2005, a visiting Ph.D student at the CNM National Centre for Microelectronics, Sevilla, Spain, in advanced logic design. In 2009, he was a postdoctoral researcher at intoPIX, Louvain-la-Neuve, Belgium, in low-power design for JPEG2000 image processing. In 2010, he was a visiting postdoctoral researcher at the UC Berkeley Laboratory for Manufacturing and Sustainability, Berkeley, CA, in life-cycle assessment of the semiconductor environmental impact. In 2015, he participated to the creation of e-peas semiconductors, Liège, Belgium. He is now an assistant professor in the ICTEAM institute of UCLouvain.

Prof. Bol is currently leading with Prof. Denis Flandre the 
Electronic Circuits and Systems (ECS) research group focused on ultra-low-power design of integrated circuits for the IoT including computing, power management, sensing and RF communications with focuses on technology/circuit interaction in nanometer CMOS nodes, mixed-signal SoC implementation and variability mitigation. He is also responsible of four M.Sc courses in Electrical Engineering at UCL on digital, analog and mixed-signal integrated circuits and systems as well as sensors.

Pr. Bol has authored or co-authored more than 70 technical papers and conference contributions and holds three patents. He (co-)received three Best Paper/Poster/Design Awards in IEEE conferences (ICCD 2008, SOI Conf. 2008, FTFC 2014). He is an associate editor for MDPI J. Low-Power Electronics and Applications and a TPC member for IEEE SubVt and S3S conferences. He also serves as a reviewer for various journals and conferences such as IEEE J. of Solid-State Circuits, IEEE Trans. on VLSI Syst., IEEE Trans. on Circuits and Syst. I/II and ACM Design Automation Conf. Since 2008, he presented several invited papers and keynote tutorials in international conferences.

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