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| Pr. David Bol Microelectronics laboratory - ICTEAM institute Université catholique de Louvain 1348 Louvain-la-Neuve, Belgium david [dot] bol [at] uclouvain [dot] be Résumé |
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| David Bol
was born in Ottignies, Belgium in 1981. He received the M.Sc. degree in
Electromechanical Engineering from
Université
catholique de Louvain
(UCLouvain), Louvain-la-Neuve, Belgium in 2004. From 2004 to 2008, he
was a Ph.D student at the Microelectronics laboratory from UCLouvain. In 2008, he
received
the Ph.D degree in Engineering Science for a
dissertation entitled "Pushing Ultra-Low-Power Digital Circuits into
the
Nanometer Era". In 2004, he was an exchange student at the KTH Royal Institute of Technology, Stockholm, Sweden, in embedded systems and in 2005, a visiting Ph.D student at the CNM National Centre for Microelectronics, Sevilla, Spain, in advanced logic design. In 2009, he was a postdoctoral researcher at intoPIX, Louvain-la-Neuve, Belgium, in low-power design for JPEG2000 image processing. In 2010, he was a visiting postdoctoral researcher at the UC Berkeley Laboratory for Manufacturing and Sustainability, Berkeley, CA, in life-cycle assessment of the semiconductor environmental impact. He is now an assistant professor in the ICTEAM institute of UCLouvain, teaching nanoelectronics and conducting researches in green VLSI and SoCs for sustainability in nanoelectronics. His research interests include ultra-low-power design of integrated circuits and systems, technology/circuit interaction in nanometer CMOS nodes, mixed-signal SoC implementation, variability mitigation, compact modeling, VLSI design automation, nano-CMOS and post-CMOS technologies, as well as green semiconductor manufacturing. Pr. Bol has authored or co-authored more than 50 technical papers and conference contributions and holds a patent. In 2008, he received the Best Paper and Best Poster Awards from the IEEE Int. Conf. on Computer Design (ICCD) and the IEEE Int. SOI Conf., respectively. He is an associate editor for MDPI J. Low-Power Electronics and Applications and a TPC member for IEEE SubVt and S3S conferences. He also serves as a reviewer for various journals and conferences such as IEEE J. of Solid-State Circuits, IEEE Trans. on VLSI Syst., IEEE Trans. on Circuits and Syst. I/II and ACM Design Automation Conf. Since 2008, he presented several invited keynote tutorials in international conferences. |
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